SunTech Ultra V Series
Suntech Ultra V module adopts 182 mm silicon wafer, increases the wafer size, optimizes the layout profoundly and decreases the invalid power generation area.
high-density cell interconnect technology on Ultra V module, which can shorten distance between the cells and decrease the invalid power generation area greatly and improves the energy density of the module.
The use of flexible special welding strip can mostly assure the reliability of the welding process between the cells, to improve the yield of the product effectively
Suntech has particularly optimized structure design and own the exclusive patent. The module weighs 24.4 KG, 15% lower than the products of the same specification.
Using 2.5 mm-thick fully tempering glass combined with the specially optimized module structure design, the mechanical load capacity is greatly improved. When the load reaches +5400 / -2400 pa, the maximum stress of module structure is reduced by 23% compared with conventional structure design, the maximum deformation is reduced by 37%, and then avoid the risk of micro crack loss.